The compressed air requirements for semiconductor manufacturing have been upgraded from the traditional Class 0 oil-free standard to ultra-clean vacuum. Taking 7nm chip production process as an example, lithography needs air source with oxygen content <1ppm and particle size <0.1μm, while
ZAKF Screw Compressor supplier has improved the purity to 10-⁷Pa through material innovation, precision upgrading and intelligent monitoring, which has become the core equipment of TSMC and other wafer factories.
I. Technological Breakthroughs: ZAKF's Three Innovations for Semiconductors
Oil-free design of the whole chain
316L stainless steel + ceramic coating (e.g., ZAKF's silicon carbide coating) is used for the rotor and chamber, with a surface roughness of Ra ≤ 0.2 μm, which has lowered the concentration of particulate matter in the air source from 500 particles per m³ to 12 particles per m³ after application in a Korean LCD factory. The sealing system is made of perfluoroether rubber (FFKM) + air film seal, the leakage rate is <1×10-⁹Pa・m³/s under - 0.09MPa vacuum, which meets the SEMI S2 standard.The oil-free design of ZAKF screw compressor supplier eliminates the lubricating oil contamination, which lays the foundation of the semiconductor clean process. The ZAKF Screw Compressor Supplier
Ultra-precision machining process
ZAKF screw compressor supplier uses German 5-axis machining center to manufacture rotor, tooth precision of ± 0.002mm, compared with the traditional process 5 times. Measurements at a wafer fab in Taiwan show that the oil content in the compressed air has been reduced from 0.01mg/m³ to 0.003mg/m³ (the lower limit of detection), which meets the requirements for ultra-clean vacuum. This precision processing capability ensures that no metal particles are released during the compression process and meets the stringent requirements of semiconductors for the purity of the air source.
Intelligent purity monitoring system
ZAKF screw compressor supplier's equipment integrated with 0.1μm particle counter and 0.1ppm resolution oxygen sensor, data real-time access to the factory MES system. AI algorithms can automatically adjust the speed of speed, after the application of a memory chip factory due to gas source contamination caused by the loss of yield reduced by 78%. Through real-time monitoring and intelligent adjustment, ZAKF realizes the dynamic optimization of gas source purity and avoids affecting chip yield due to gas source problems.
Upgrade of semiconductor gas source standard in three dimensions
The traditional Class 0 standard can no longer meet the requirements of EUV lithography and other cutting-edge processes. ZAKF screw compressor suppliers promote the new standard requirements:
Particle control: ≥0.05μm particles <5 /m³ (ISO 14644-1 Class 5), a 20-fold increase compared with the original standard (≥0.1μm particles <100/m³); Oxygen content: photolithography process <100/m³; Oxygen content: photolithography process <1000m particles <100/m³). Oxygen content: <1ppm for lithography, a 10-fold improvement over the traditional requirement (<10ppm);
Oil vapors: mass spectrometry detection limit of <0.001mg/m³, with near-zero emissions.
These upgrades directly contribute to the advancement of semiconductor manufacturing processes, ensuring the stability of 7nm and more advanced processes.
ZAKF typical application scenarios and industry cases
EUV lithography machine supporting
ASML EUV equipment requires a gas source vacuum ≤ 10-⁵Pa, ZAKF screw compressor suppliers to provide oil-free screw compressor and cryogenic pumps combination of solutions in the Netherlands R & D center to achieve 10-⁷Pa vacuum, the gas source vacuum ≤ 10-⁷Pa. ⁷Pa ultra-clean vacuum in the Netherlands R&D Center, ensuring that the extreme ultraviolet light transmission pipeline is free of oil contamination, and providing a guaranteed air source for high-precision imaging of EUV lithography.
3D NAND wafer cleaning
A Micron plant uses a ZAKF screw compressor supplier's Water lubricated
oil free compressor with a 0.01μm filter to maintain the dew point of the gas source at -70°C, avoiding wafer oxidation and increasing yields by 3.2%. This solution not only meets the drying requirements of the cleaning process, but also eliminates secondary contamination through the oil-free design.
Advanced Packaging Bonding Process
Sun Micron uses ZAKF oil free scroll compressor (noise ≤ 62dB) in flip-chip soldering, the purity of the gas source meets the bonding requirements of 15μm gold wires, and the defective rate of bonding has been reduced from 0.8% to 0.15%. ZAKF's equipment guarantees the precision operation of the advanced packaging process with its low vibration and high purity characteristics.
Industry standard iteration and ZAKF's technological response
SEMI's S22.11 standard, released in 2024, refines the oil-free class of semiconductor compressors to Class 0.1. ZAKF's screw compressor supplier has invested RMB 200 million in the construction of an ultra-clean lab, and its equipment, with ULPA filters (99.9995% efficiency) + ozone decomposition device, realizes in SMIC production lines that The TOC of the gas source is <5ppb, far exceeding the industry requirement. This technological breakthrough has made ZAKF a benchmark supplier of semiconductor gas source equipment, leading the industry standard to ultra-clean vacuum.
From 14nm to 3nm process evolution, semiconductor manufacturing requirements for gas source has changed from “oil-free” to “extremely pure”, ZAKF screw compressor supplier not only supports EUV lithography, atomic layer deposition and other cutting-edge processes, but also promotes the industry standard of ultra-clean vacuum. Through breakthroughs in materials, processes and smart technologies, ZAKF screw compressor suppliers have not only supported cutting-edge processes such as EUV lithography and atomic layer deposition, but also promoted the comprehensive upgrading of industry standards. With the arrival of 3nm mass production in 2025, ZAKF's ultra-clean vacuum solutions will become the core competitiveness of the wafer fab gas source system, providing solid guarantee for the precision and yield of semiconductor manufacturing.
